Boyd, one of the world's leading innovators in sustainable engineered materials and thermal solutions has introduced k-Core a patented, and high-performance advanced solid conduction material system for aerospace and spacecraft communications satellites.
The main component of k-Core is APG, which has an in-plane, isotropic room-temperature thermal conductivity of 1700 W/m.K. Thermal conductivity is 7-8 times greater than solid aluminum and 4-5 times greater than copper.
The use of k-Core significantly reduces peak semi-conductor temperatures. It features a smaller heat sink size and comes with a fully hermetic encapsulation that is rugged and resistant to damage.
k-Core can be fabricated by employing most conventional thermal management metals and materials as the encapsulant, such as aluminum and copper alloys, ceramics, and composites, depending on the user’s need and application.
Click here to learn about k-Core Advanced Solid Conduction Material System.
Click here to learn about Thermal Straps from various manufacturers listed on SATNow.
